je to tenhle SPECIFICATIONS Essentials Status Launched # of Cores 1 # of Threads 1 Clock Speed 3 GHz L2 Cache 2 MB Bus/Core Ratio 15 FSB Speed 800 MHz FSB Parity Yes Instruction Set 64-bit Embedded Options Available No Supplemental SKU No Lithography 90 nm Max TDP 110 W VID Voltage Range 1.2875V-1.3875V 1ku Bulk Budgetary Price $247.00 Memory Specifications Physical Address Extensions 32-bit ECC Memory Supported No Package Specifications TCASE 72°C Package Size 42.5mm x 42.5mm Processing Die Size 135 mm2 # of Processing Die Transistors 169 million Sockets Supported PPGA604 Halogen Free Options Available No Advanced Technologies Intel® Turbo Boost Technology No Intel® Hyper-Threading Technology No Intel® Virtualization Technology (VT-x) No Intel® Trusted Execution Technology No Intel® 64 Yes Idle States Yes Enhanced Intel SpeedStep® Technology No Intel® Demand Based Switching No Execute Disable Bit Yes

nebo tenhle SPECIFICATIONS Essentials Status Launched Launch Date Q4'07 Processor Number E5450 # of Cores 4 # of Threads 4 Clock Speed 3 GHz L2 Cache 12 MB Bus/Core Ratio 9 FSB Speed 1333 MHz FSB Parity Yes Instruction Set 64-bit Embedded Options Available No Supplemental SKU No Lithography 45 nm Max TDP 80 W VID Voltage Range 0.850V-1.3500V 1ku Bulk Budgetary Price $915.00 Package Specifications TCASE 67°C Package Size 37.5mm x 37.5mm Processing Die Size 214 mm2 # of Processing Die Transistors 820 million Sockets Supported LGA771 Halogen Free Options Available Yes Advanced Technologies Intel® Turbo Boost Technology No Intel® Hyper-Threading Technology No Intel® Virtualization Technology (VT-x) Yes Intel® Trusted Execution Technology No Intel® 64 Yes Idle States Yes Enhanced Intel SpeedStep® Technology Yes Intel® Demand Based Switching Yes Thermal Monitoring Technologies Yes Execute Disable Bit